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3D-printed PEEK/BN nanocomposites with enhanced thermal and mechanical performance for advanced chip packaging
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DOI：10.1007/s00289-026-06643-8.png)
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Abstract
En 中文
High-performance polymer composites for advanced chip packaging require an effective balance of thermal conductivity, electrical insulation, dimensional stability, and mechanical reliability. In this study, boron nitride nanosheet-reinforced polyether ether ketone nanocomposites were fabricated through melt compounding followed by fused deposition modeling. The boron nitride nanosheets were modified using 3-aminopropyltriethoxysilane to improve filler–matrix interfacial compatibility and dispersion within the PEEK matrix. The results showed that the incorporation of functionalized BN significantly improved the thermal performance of the printed composites. Thermal conductivity increased with BN loading and reached approximately 3.0–3.2 W·m⁻¹·K⁻¹, while the coefficient of thermal expansion decreased to approximately 38–42 ppm·°C⁻¹, indicating improved dimensional stability under thermal exposure. Thermogravimetric analysis showed that the onset of thermal degradation shifted from approximately 595 °C for neat PEEK to approximately 655 °C for the 25 wt% BN composites, while the residual mass increased from about 25% to 45%, confirming enhanced thermal resistance due to the inorganic BN phase and barrier effect. Mechanical testing showed that tensile strength was retained and slightly improved at intermediate BN loading, with the 15 wt% BN composites reaching approximately 98 MPa compared with approximately 95 MPa for neat PEEK. Young’s modulus increased from 3.6 GPa for neat PEEK to 4.2 GPa for the 25 wt% BN composites, confirming filler-induced stiffening. However, elongation at break decreased from 20% to 12% with increasing BN content due to restricted polymer chain mobility. Overall, the APTES-functionalized BN/PEEK composites demonstrated improved thermal conductivity, reduced thermal expansion, enhanced thermal stability, and retained mechanical reliability, indicating their potential as additively manufactured materials for thermally managed chip packaging applications.
Keywords:
Additive manufacturing
Polyether ether ketone (PEEK) composites
Boron nitride nanosheets
Chip packaging
Mechanical Properties
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