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A novel photocurable polymeric solid-solid phase change material for intelligent temperature regulators

delete2024-11-01
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PRE
AI
刘美琦 cover
刘美琦 (Meiqi Liu)
Z
Zhaowen Huang
A
Akbar Bashir
Y
Yichi Zhang
H
Haixia Qian
X
Xing Ouyang
Y
Yan Hu
H
Haibin Chen
陈大柱 (Dazhu Chen) *
DOI:10.1016/j.cej.2024.157322delete
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Abstract

Abstract

En 中文
The advancement of solid-solid phase change materials (SSPCMs) with crystalline segments embedded onto crosslinked polymer backbones offers a promising solution to the leakage problems associated with traditional phase change materials. Despite its potential, this technology faces challenges, including energy-intensive synthesis processes of SSPCMs and difficulties in custom designing materials for confined spaces. Herein, we introduce a novel strategy for the rapid preparation of polyurethane acrylate-based SSPCMs via UV-initiated polymerization. By leveraging crystalline segments from polyethylene glycol, the resulting SSPCM exhibits an impressive enthalpy of 110.4 J center dot g(-1), enabling seamless transitions from rigid to soft states during solid-solid phase changes. When applied in portable electronic devices, this SSPCM can be synthesized in-situ to meet various size requirements, demonstrating exceptional temperature regulation performance based on latent thermal energy storage mechanisms. Furthermore, by integrating thin layers of carbon nanotubes (CNTs) onto the rough surfaces of SSPCM films and employing a face-to-face configuration to convert temperature-sensitive mechanical changes into electric resistance variations, we have engineered high-temperature alarms for SSPCMbased temperature regulators. The advantages of this preparation strategy, combined with the thermal regulation capabilities and innovative temperature alarm design, underscore the significant potential for intelligent and adaptive applications of SSPCMs in advanced technological landscapes.
Keywords:
Solid-solid phase transition
Latent thermal energy storage
Temperature regulation
High-temperature alarm

Journal

Chemical Engineering Journal cover
Chemical Engineering Journal
IF:
13.2
Papers:
7.4W
Citations:
48.5W

Organization

S
shenzhen university
Scholars:
4.5W
Papers: 3.4W
Citations: 72