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A Novel Temperature Drift Error Precise Estimation Model for MEMS Accelerometers Using Microstructure Thermal Analysis
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DOI：10.3390/mi13060835.png)
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Owing to the fact that the conventional Temperature Drift Error (TDE) precise estimation model for a MEMS accelerometer has incomplete Temperature-Correlated Quantities (TCQ) and inaccurate parameter identification to reduce its accuracy and real time, a novel TDE precise estimation model using microstructure thermal analysis is studied. First, TDE is traced precisely by analyzing the MEMS accelerometer's structural thermal deformation to obtain complete TCQ, ambient temperature T and its square T-2, ambient temperature variation increment T and its square increment T-2, which builds a novel TDE precise estimation model. Second, a Back Propagation Neural Network (BPNN) based on Particle Swarm Optimization plus Genetic Algorithm (PSO-GA-BPNN) is introduced in its accurate parameter identification to avoid the local optimums of the conventional model based on BPNN and enhance its accuracy and real time. Then, the TDE test method is formed by analyzing heat conduction process between MEMS accelerometers and a thermal chamber, and a temperature experiment is designed. The novel model is implemented with TCQ and PSO-GA-BPNN, and its performance is evaluated by Mean Square Error (MSE). At last, the conventional and novel models are compared. Compared with the conventional model, the novel one's accuracy is improved by 16.01% and its iterations are reduced by 99.86% at maximum. This illustrates that the novel model estimates the TDE of a MEMS accelerometer more precisely to decouple temperature dependence of Si-based material effectively, which enhances its environmental adaptability and expands its application in diverse complex conditions.
Keyword:
MEMS accelerometer
temperature dependence
microstructure thermal analysis
TDE precise test based on heat conduction analysis
PSO-GA-BPNN
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3
论文数:
1.4W
被引数:
2.9W
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