arrow
返回

A robust positioning method based on semantic segmentation network for DIE chips

delete2024-12-01
delete1
PRE
AI
D
Dezhi Yang
R
Rong Li *
X
Xinyu Suo
J
Jian Liu
S
Shaohui Yin
DOI:10.1016/j.jmapro.2024.10.021delete
delete原文链接
delete原文求助
delete分享
delete收藏
摘要

摘要

En 中文
The accurate and fast positioning of DIE chips is crucial for conducting high and low temperature online performance tests during the manufacturing process of chips. The original online performance test equipment for DIE chips cannot accurately locate polluted chips, resulting in serious missing and false detections. To address this issue, this paper proposes a robust positioning method based on semantic segmentation network for DIE chips. Unet is used to segment the two circular electrodes of the DIE chip. After that, image processing techniques, such as contour extraction and circle fitting, are employed to extract the precise location of the DIE chip. To satisfy the requirements of fast and precise positioning, improved strategies such as modifying convolutional blocks, compressing the channels of convolutional layers, the weighted combination of the dice and the crossentropy loss function, and so on are adopted to improve Unet (named IUnet). Additionally, to address the issue of insufficient samples for the low temperature performance test, model-based transfer learning is employed to improve the segmentation accuracy of IUnet. The experimental results show that the proposed method, compared with mainstream methods such as traditional methods (template matching and Hough circle detection), target detection methods (SSD, YoloV7, and FasterRCNN), and semantic segmentation methods (SegNet, DeeplabV3+, Unet, Res-Unet++, and Swin-Unet), has better positioning performance and robustness. Under the premise of achieving a positioning beat of 0.5 s per chip, the positioning accuracy rate of DIE chips can reach 100 %, thereby satisfying the positioning requirements of the enterprise.
Keyword:
DIE chip
Target positioning
Machine vision
Semantic segmentation

期刊

Journal of Manufacturing Processes 封面图
Journal of Manufacturing Processes
IF:
6.8
论文数:
8.0K
被引数:
3.5W

机构

H
hunan university
学者数:
4.5W
论文数: 3.3W
被引数: 70
引用论文

引用论文

err分享
err收藏
Electrochemically assisted micro localized grafting of aptamers in a microchannel engraved in fluorinated thermoplastic polymer Dyneon THV
err2015-01-01
err0
PREAI
errC. Perréard; Y. Ladner; F. d'Orlyé; S. Descroix; V. Taniga; A. Varenne; F. Kanoufi; C. Slim; S. Griveau; F. Bedioui
err分享
err收藏
Efficient pruning of multilayer perceptrons using a fuzzy sigmoid activation function
err2006-03-01
err3
PREAI
errSoria-Olivas, E; Martín-Guerrero, JD; Serrano-López, AJ; Calpe-Maravilla, J; Vila-Francés, J; Camps-Valls, G
err分享
err收藏
A high-precision detection method for coated fuel particles based on improved faster region-based convolutional neural network
err2022-12-01
err9
PREAI
errHu, Zhaochuan; Liu, Jian; Jiang, Chao; Zhang, Hang; Chen, Ning; Yang, Zhiyuan
err分享
err收藏
A critical review for machining positioning based on computer vision
err2021-11-01
err29
PREAI
errHe, Wenbin; Jiang, Zhiwen; Ming, Wuyi; Zhang, Guojun; Yuan, Jie; Yin, Ling
err分享
err收藏
学者 查看更多内容