arrow
Return

A STEM tomographic multiplication nano-moiré method

delete2023-01-01
delete0
PRE
AI
Y
Yao Zhao
H
Huihui Wen
Y
Yang Yang
J
Jie Dong
W
Wei Feng
H
Hongye Zhang
刘战伟 (Zhanwei Liu) *
刘超 cover
刘超 (Chao Liu) *
DOI:10.1039/d3nr03967fdelete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En 中文
Heterojunction optoelectronic technology has extensive applications in modern optoelectronics. The lattice quality and mismatch strain near the heterojunction interface significantly affect the photoelectric performance of a photoelectronic device. Therefore, accurately characterizing the internal three-dimensional (3D) strain at the interface in a large field is essential to evaluate the heterojunction optoelectronic device quality. Here, we propose a tomographic multiplication nano-moire method for internal 3D strain measurements in a large field. This method operates by combining the depth sectioning technique of scanning transmission electron microscopy (STEM) with the multiplication moire method. A mutual overlapping analytical method based on spherical aberration correction is adopted in 3D reconstruction to achieve the nanometer resolution in the depth direction. The developed method overcomes the small measurement field of view (FOV) limitation of the conventional transmission electron microscope and provides high resolution and a large measurement volume, potentially facilitating the evaluation of the large-scale 3D internal lattice quality and strain field characterization. Using the proposed method, the 3D distribution of dislocations and strain fields in the [011] direction at the heterojunction interface of the InP/InGaAs nanomaterial is intuitively, clearly, and comprehensively revealed. The tomographic multiplication nanometer moire method has been developed to visualize lattice deformation in 3D over a large field of view.
Keywords:
ATOM-PROBE
RESOLUTION

Journal

Nanoscale cover
Nanoscale
IF:
5.1
Papers:
3.0W
Citations:
11.6W

Organization

B
beijing institute of technology
Scholars:
5.4W
Papers: 3.9W
Citations: 63
I
institute of semiconductors, cas
Scholars:
1.6K
Papers: 1.3K
Citations: 3
T
Technical University of Munich
Scholars:
5.2W
Papers: 3.9W
Citations: 6.2W
B
beijing forestry university
Scholars:
1.9W
Papers: 1.1W
Citations: 3
C
chinese academy of sciences
Scholars:
55.9W
Papers: 44.7W
Citations: 704
researcher View more organizations