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An aggregated optimization model for multi-head SMD placements
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DOI：10.1016/j.cie.2010.10.004.png)
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摘要
En 中文
In this article we propose an aggregate optimization approach by formulating the multi-head SMD placement optimization problem into a mixed integer program (MIP) with the variables based on batches of components. This MIP is tractable and effective in balancing workload among placement heads, minimizing the number of nozzle exchanges, and improving handling class. The handling class which specifies the traveling speed of the robot arm, to the best of our knowledge, has been for the first time incorporated in an optimization model. While the MIP produces an optimal planning for batches of components, a new sequencing heuristics is developed in order to determine the final sequence of component placements based on the outputs of the MIP. This two-stage approach guarantees a good feasible solution to the multi-head SMD placement optimization problem. The computational performance is examined using real industrial data. (C) 2010 Elsevier Ltd. All rights reserved.
Keyword:
Multi-head surface mounting device
Component placement
Variable placement speed
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期刊
IF:
6.5
论文数:
1.0W
被引数:
3.8W
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