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Circumferential peeling of elastic films from cylindrical substrates: Theoretical modeling and atomistic simulations
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DOI：10.1016/j.tws.2026.115341.png)
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Abstract
En 中文
● A variational model is developed for circumferential peeling of elastic films from cylindrical substrates. ● Substrate curvature and peeling angle jointly influence the peeling evolution. ● The theoretical model captures the peeling response in the post-initiation regime. ● A scaling law for the peak peeling force at the initiation stage in terms of adhesion, geometry, and film stiffness.
Keywords:
Film-substrate system
Cylindrical substrate
Interfacial peeling
Theoretical model
Molecular dynamics
Journal
T
IF:
6.6
Papers:
1.1W
Citations:
4.0W
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