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CMOS-based microsensors and packaging
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DOI：10.1016/S0924-4247(01)00532-5.png)
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CMOS-based microsensors benefit from well-established fabrication technologies and the possibility of on-chip circuitry. In these devices, added on-chip functionality can be implemented, such as calibration, self testing, and digital interfaces. The paper summarizes major technological approaches to CMOS-based microsensors. Two packaged microsystems, namely a thermal imager and a chemical , microsystem, fabricated using CMOS technology in combination with bulk-micromachining and thin film deposition, are reviewed. Finally, CMOS microsensors for the characterization and optimization of ball bonding processes in the microelectronics packaging industry are presented. (C) 2001 Elsevier Science B.V. All rights reserved.
Keyword:
CMOS
post-processing
chemical sensor
infrared radiation sensor
thermal imager
ball bond characterization
wire bonder calibration
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4.9
论文数:
1.5W
被引数:
3.3W
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