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Construction of thermal-stability maps for nanocrystalline metals and alloys with U-shaped dependence of stability on grain size

delete2026-05-08
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PRE
AI
H
H.T. Jeong *
W
Woo Jin Kim *
DOI:10.1016/j.actamat.2026.122329delete
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Abstract

Abstract

En 中文
Nanocrystalline metals and alloys are attractive for a wide range of applications, but their broader use is often limited by poor thermal stability. Classical curvature-driven grain-growth theory predicts progressively faster coarsening with decreasing grain size. However, recent experiments across face-centered cubic (FCC) metals and alloys have revealed a non-monotonic stability trend: the thermal-stability-limit temperature—defined as the temperature at which grain growth rapidly accelerates for a fixed exposure time—first decreases with grain refinement in the microscale regime but increases again in the nanoscale regime, producing a U-shaped stability response. In this work, we extend the classical grain-growth law by incorporating junction-mediated kinetic resistance, with coherent twin boundary (CTB)-mediated triple-junction drag identified as a key contribution. The dimensionless drag parameter is formulated from mechanistically motivated mobility contrasts, CTB density, and size-dependent junction statistics. A single calibration constant is determined from pure Cu and then held fixed across other materials to test transferability. Time-resolved mean-field simulations—using temperature-dependent parameters and purity-dependent diffusivities—reproduce the U-shaped stability behavior across FCC systems and further enable construction of time-temperature thermal-stability maps. These maps can be used to guide grain-size selection and define practical service windows for property-targeted microstructure design.
Keywords:
nanocrystalline metals
thermal stability
grain growth
U-shaped stability
triple-junction drag

Journal

Acta Materialia cover
Acta Materialia
IF:
9.3
Papers:
2.0W
Citations:
12.9W

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