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Embedding Components During Laser Sintering
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DOI：10.1016/j.addlet.2022.100055.png)
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摘要
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We propose an approach for embedding electronic components during a Selective Laser Sintering (SLS) process. Common SLS processes are incompatible with component embedding because generating voids in the parts developed using this production method is logistically challenging. Here, we use an inverted laser sintering (ILS) process that sidesteps the need for a powder bed, and can therefore trivially generate voids in printed components. We demonstrate this method by embedding an LED inside an SLS part cavity, and then resuming the printing process. The LED is then externally activated, confirming its functionality after several layers are added. This ability could help transform SLS from fabricating passive parts to active systems.
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4.7
论文数:
399
被引数:
895
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