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Enhancing ball grid array (BGA) component design and reliability using a novel reliability-based design optimization (RBDO) methodology
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DOI：10.1080/15376494.2023.2237694.png)
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摘要
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In industry and research areas, the importance of reliable and optimally designed BGA components has remarkably grown. To tackle this challenge, we elaborated an innovative approach that optimizes of the BGA's structure. By adopting the RBDO method, we assess the geometric design variables of the BGA component and determine the optimal variables that promote the structure's efficiency level. Our approach considers technical and economic feasibility, ensuring an optimal design of the BGA solder joints. This work rests upon coupling Ansys and MATLAB software. The current paper reports our investigation's results, highlighting our approach's benefits and potential for practical applications.
Keyword:
Solder joints
electro-thermomechanical loading
reliability-based design optimization
optimal performance
cost-effective
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论文数:
4.9K
被引数:
1.4W
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