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From Supply Chains to Interdependent Logistics Infrastructure: Topological Fragility, Shock Amplification and Orbital Computing
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DOI：10.3390/logistics10070146.png)
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Abstract
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Background: High-technology supply chains are interdependent logistics infrastructures in which digital, energy, manufacturing, cloud and orbital layers are tightly coupled. This paper examines how such layering changes supply chain resilience and systemic vulnerability. Methods: The paper develops an analytical–conceptual framework linking supply chain resilience, interdependent infrastructure theory and network topology. It introduces Topological Phase Vulnerability (TPV), capturing proximity to structural fragility thresholds, and the Shock Amplification Coefficient (SAC), conceptualizing disruption amplification as a function of centrality concentration, cross-layer coupling and reconfiguration capacity. The framework is supported by a fuzzy-inspired diagnostic scorecard and stylized assessment of alternative infrastructure configurations. Orbital computing is an extreme illustrative context because it combines dependence on advanced semiconductor fabrication, hyperscale cloud orchestration, energy systems, launch capacity and logistics coordination. Results: Highly centralized configurations are more likely to transform local disruptions into cross-layer cascades, whereas modular and distributed configurations are more likely to contain disruption through redundancy, substitutability and rerouting. Conclusions: Resilience in next-generation logistics infrastructure depends not only on capacity or component reliability, but also on topology. Centrality dispersion, modularity and reconfiguration capacity are critical design principles for reducing shock amplification in high-technology supply chains.
Keywords:
supply chain resilience
logistics infrastructure
interdependent infrastructures
topological fragility
shock amplification
network centrality
orbital computing
high-technology supply chains
reconfiguration capacity
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