Fully SMT-compatible optical-I/O package with microlens array interface

doi:10.1109/JLT.2003.808611

Fully SMT-compatible optical-I/O package with microlens array interface

2003-01-01

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AI

DOI：10.1109/JLT.2003.808611

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A new optoelectronic package for interchip optical interconnections is presented. To make cost-effective IC-packaging and printed circuit board (PCB) assembly, we strongly emphasize the need for full compatibility with surface-mount technology (SMT). Based on the OptoBump interface, which couples the package and PCB by means of an array of wide, collimated beams, we developed two prototype packages: a transmitter package that contains a vertical-cavity surface-emitting laser (VCSEL) array and a driver-IC, and a receiver package that contains a photodiode (PD) array and a receiver-IC. A microlens array is integrated with each package to counteract misalignments that occur in the SMT process. All three output signals, which are E/O (O/E)-converted in the each package, exhibit clear eye diagrams at 1.25 Gb/s after the packages are surface-mounted on a PCB. The influence of polymer encapsulation on a VCSEL and an evaluation of the optical interface provided by the three optical beams on a 500-mum center-to-center spacing are also discussed.

Keyword:

Microlens

optical interconnections

packaging surface-mount technology

vertical-cavity surface-emitting laser

Fully SMT-compatible optical-I/O package with microlens array interface

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