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Geometry-Based Modulation Strategy for Interfacial Diffusion Kinetics as Demonstrated in Laser-Engineered SAC305/Cu Solder Joints
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DOI：10.1016/j.jmatprotec.2026.119322.png)
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Abstract
En 中文
• Geometry structure as composition-independent design variable for interfacial diffusion kinetics. • Geometric structure modulates diffusion flux via coupling chemical potential and diffusion path length. • Curvature is identified as an important parameter in interfacial diffusion kinetics. • Geometry structures enable spatial control of interfacial intermetallic compounds (IMCs) morphology in Sn/Cu joint. • 21.5% thickness reduction of IMC in Sn/Cu joint achieved via additive-free geometric design.
Keywords:
Geometry structure
Interfacial diffusion kinetics
Curvature
Intermetallic compounds
Spatial control
Journal
J
IF:
7.5
Papers:
1.6W
Citations:
4.5W
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Cited Papers