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High-Resolution 3D Printing for Electronics

delete2022-01-17
delete97
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OA
AI
Y
Young‐Geun Park
I
In Sik Yun
W
Won Gi Chung
W
Wonjung Park
D
Dong Ha Lee
J
Jang‐Ung Park *
DOI：10.1002/advs.202104623delete
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摘要

摘要

En 中文
形成任意3D结构的能力在电子设备的设计中提供了下一水平的复杂性和更大的自由度。由于电子技术的最新进展扩大了它们在需要结构一致性和动态配置的各个领域的适用性，高分辨率3D打印技术可以为自由形式电子提供巨大的潜力。在这里，综述了用于自由电子器件的新型3D打印方法的最新进展，为各种设备组件的3D打印功能材料和工艺提供了全面的研究。还回顾了3d打印电子产品的最新进展，以解释代表性的设备组件，包括互连，电池，天线和传感器。此外，考虑了下一代印刷电子的关键挑战和前景，并根据最近出现的研究探索了未来的方向。
Keyword:
3D printings
freeform electronics
integrated circuits
printed electronics
wireless sensors
AI总结

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对已上传原文的论文进行重点信息的提取，主要内容包括：简要概述、研究摘要、背景介绍、关键亮点、图文解析、展望与总结。

期刊

Advanced Science 封面图
Advanced Science
IF:
14.1
论文数:
1.8W
被引数:
11.5W

机构

Y
Yonsei University
学者数:
4.8W
论文数: 4.6W
被引数: 5.2W
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