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Highly Ordered Eutectic Mesostructures via Template-Directed Solidification within Thermally Engineered Templates

delete2024-01-12
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OA
AI
S
Sung Bum Kang
G
Guanglong Huang
G
Gaurav Singhal
D
Dajie Xie
D
Daniel Hsieh
Y
Youngmun Lee
A
Ashish Kulkarni
J
John W. Smith
陈茜 封面图
陈茜 (Qian Chen)
K
Katsuyo Thornton *
S
Sanjiv Sinha
P
Paul V. Braun *
DOI:10.1002/adma.202308720delete
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摘要

摘要

En 中文
Template-directed self-assembly of solidifying eutectics results in emergence of unique microstructures due to diffusion constraints and thermal gradients imposed by the template. Here, the importance of selecting the template material based on its conductivity to control heat transfer between the template and the solidifying eutectic, and thus the thermal gradients near the solidification front, is demonstrated. Simulations elucidate the relationship between the thermal properties of the eutectic and template and the resultant microstructure. The overarching finding is that templates with low thermal conductivities are generally advantageous for forming highly organized microstructures. When electrochemically porosified silicon pillars (thermal conductivity < 0.3 Wm(-1)K(-1)) are used as the template into which an AgCl-KCl eutectic is solidified, 99% of the unit cells in the solidified structure exhibit the same pattern. In contrast, when higher thermal conductivity crystalline silicon pillars (approximate to 100 Wm(-1)K(-1)) are utilized, the expected pattern is only present in 50% of the unit cells. The thermally engineered template results in mesostructures with tunable optical properties and reflectances nearly identical to the simulated reflectances of perfect structures, indicating highly ordered patterns are formed over large areas. This work highlights the importance of controlling heat flows in template-directed self-assembly of eutectics.
Keyword:
complex mesostructures
eutectic solidification
photonics
template-directed self-assembly
thermal engineering
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期刊

Advanced Materials 封面图
Advanced Materials
IF:
26.8
论文数:
3.4W
被引数:
46.0W

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University of Illinois Urbana-Champaign
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被引数: 35
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University of Illinois System
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U
university of michigan system
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引用论文

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