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Integrated computational investigation of interfacial bonding and stress mitigation mechanisms in C/C-SiC/410B stainless steel brazed joints

delete2026-08-05
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PRE
AI
H
Haitao Zhu
W
Wenlong Zhou
X
Xingyi Li
Y
Yanyu Song *
H
Hyoung Seop Kim
D
Duo Liu
S
Shengpeng Hu
X
Xiaoguo Song
DOI：10.1016/j.compositesb.2026.114056delete
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Abstract

Abstract

En 中文
• Reliable bonding of C/C-SiC to 410B SS was achieved using a CuMn filler. • Potential gradient drives reactions and d-p hybridization aids bonding. • Gradient interface mitigated stress to yield peak strength at 980 °C.

Journal

Composites Part B-Engineering cover
Composites Part B-Engineering
IF:
14.2
Papers:
1.2W
Citations:
8.9W

Organization

P
POSTECH
Scholars:
925
Papers: 378
Citations: 7
H
Harbin Institute of Technology
Scholars:
1.1W
Papers: 3.8K
Citations: 8.5W
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