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Integrated thermal dissipation micro structures for CDFP optical module
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DOI：10.1007/s11082-020-2254-5.png)
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400 Gbit/s optical module will soon be commercially deployed on a large scale due to the need for high capacity information transmission. It has much higher power density than that of 100 Gbit/s and 40 Gbit/s and therefore the thermal management still remains an obstacle. Microscale and nanoscale thermal management technology emerges and blooms. Concentrating on the thermal design of CDFP optical module, we propose two integrated thermal dissipation micro structures (ITDMS). The first is graphene thermal pad (GTP)-based one, the second is omega-typed (OMEGA). Based on basic heat transfer equations and by SOLIDWORKS Flow Simulation software, the ITDMS are numerically validated for effective heat dissipation of CDFP optical modules and hence have great prospects for solving the heat dissipation problem of high-speed broadband optical modules due to the thermal integration solutions.
Keyword:
400 Gbit
s
Optical module
Thermal design
Integrated thermal dissipation micro structures (ITDMS)
Heat transfer equations
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