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Interaction effect crack-interfacial crack using finite element method

delete2010-01-01
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PRE
AI
D
Djamel Ouinas *
A
A. Hebbar
B
B. Bachir Bouiadjra
N
N. Benderdouche
B
B. Sérier
DOI:10.1016/j.matdes.2009.06.013delete
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摘要

摘要

En 中文
The interaction effect of an interfacial crack-microcrack modifies considerably the fracture behaviour of S45C/Si(3)N(4) bimaterial. This work aims at studying the interaction effect of a crack located in one of the materials constituting the assembly near the interface, and that between an interfacial crack and a microcrack parallel to the interface by using the finite element method. The effect of transverse and longitudinal interaction distances between the interfacial crack and the microcrack are highlighted. The stress intensity factor of the interacting cracks and the bimaterial mechanical properties influence on the conditions of deviation and propagation of crack by interface and intercrack are examined. (C) 2009 Elsevier Ltd. All rights reserved.
Keyword:
Interfacial crack
Stress intensity factor (SIF)
Energy release rate
Fracture mechanics
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期刊

M
Materials and Design
IF:
7.9
论文数:
1.9W
被引数:
9.8W

机构

U
university djillali liabes sidi bel abbes
学者数:
1.4K
论文数: 1.1K
被引数: 3
U
universite abdelhamid ibn badis de mostaganem
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573
论文数: 351
被引数: 0
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