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Investigation of etching bath for surface roughness of Evanohm alloy to enhance adhesion with electroless Cu/Ni-P coatings
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DOI：10.1007/s10800-026-02473-8.png)
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Abstract
En 中文
A ternary etching bath containing ceric ammonium nitrate, nitric acid, and dodecyl dimethyl ammonium chloride was developed to improve the surface roughness of Evanohm alloy, leading to an enhanced adhesion Behavior with electroless Cu and Ni-P coatings. Electrochemical tests and SEM results indicated that the ternary etching bath pretreatment could synergistically form effective corrosion in local direction to form mechanical interlocking structure for subsequent electroless Cu and Ni-P coatings. In addition, above etching process caused the Evanohm alloy to form a superhydrophilic surface with a contact angle of 27.0 degrees and a roughness (Sq value) of 2.22 mu m for good electroless coating process. 5B-level bonding performance could be found between the etched Evanohm alloy and electroless Cu coating, attributed to the formation of mechanical interlocking structure after bath etching. Finally, graphical resistor circuit of Evanohm alloy was successfully fabricated with good adhesion of electroless Cu and Ni-P coatings.
Keywords:
Evanohm alloy
Etching pretreatment
Adhesion enhancement
Electroless coating
Surface roughness
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3
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963
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9.0K
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