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Material Gradients in Stretchable Substrates toward Integrated Electronic Functionality
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DOI：10.1002/adma.201505818.png)
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Abstract
En 中文
The approach toward a stretchable electronic substrate employs multiple soft polymer layers patterned around silicon chips, which act as surrogates for conventional electronics chips, to create a controllable stiffness gradient. Adding just one intermediate polymer layer results in a six-fold increase in the strain failure threshold enabling the substrate to be stretched to over twice its length before delamination occurs.
Keywords:
FLEXIBLE ELECTRONICS
SENSORS
SYSTEMS
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