Microinductor for flip-chip micropower source

E. Sugawara

doi:10.1109/TMAG.2003.816052

Microinductor for flip-chip micropower source

2003-09-01

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DOI：10.1109/TMAG.2003.816052

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The rapid reduction of line width of large-scale integration (LSI) processes to a width of under 100 nm and the lowering of voltage to below 1 V to drive LSI, in addition to the sharp market growth of personal IT devices using lithium batteries, have seriously raised energy consumption around the world, necessitating the adoption of energy-saving technology using distributed small dc-dc convertors. In light of these demands, using new power microelectromechanical system technology. and continuous deposition technology, we have developed a new microinductor with a thickness of 3 00 mum. The magnetic core, consisting of CoFeSiB-Ti-SiO2 multilayer film on a polyimide sheet, is Applicable to a microinductor using a helical coil. In comparison with a mono-layer core such as a ferrite core, due to the magnetic shielding effect of each magnetic layers, a composite multilayer magnetic core is very effective in maintaining inductance up to a high dc current over 1 A. This paper proposes the use of microinductors characterized by high quality, superior dc-biased properties and low height as flip-chip sized micropower sources.

Keyword:

composite multilayer magnetic core

helical coil

micro dc/dc convertor

Microinductor for flip-chip micropower source

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