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Micropump Pattern Replication Using Printed Circuit Board (PCB) Technology
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DOI：10.1080/10426914.2012.736664.png)
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摘要
En 中文
This article shows a low-cost rapid hot embossing poly (methylmeth acrylate) (PMMA)-based micropump replication with printed circuit board (PCB) mold. PCB material offers advantages of low cost, rigid, and rapid thermal response characteristic. Unlike conventional hot embossing setup, the presented process involved the usage of simple machinery tools: laboratory oven (heat transfer), G-clamp (force deliver), and two aluminium plates (isothermal heat plates). Diffuser and pump chamber were successfully imprinted with the depth of 450 mu m and verified pump performance with other reported literatures. To avoid complex bonding process between actuator and membrane, electromagnetic pinch actuation is introduced. The micropump poses flow rate characteristic of 6.66ml/min and a back pressure of 1.6kPa under optimum pinch frequency.
Keyword:
Diffuser
Electromganetic
Hot embossing
Microfluidic
Micromechanical
Micropump
PCB
Polymers
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