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New Carbon Materials for Multifunctional Soft Electronics
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DOI：10.1002/adma.202312596.png)
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摘要
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Soft electronics are garnering significant attention due to their wide-ranging applications in artificial skin, health monitoring, human-machine interaction, artificial intelligence, and the Internet of Things. Various soft physical sensors such as mechanical sensors, temperature sensors, and humidity sensors are the fundamental building blocks for soft electronics. While the fast growth and widespread utilization of electronic devices have elevated life quality, the consequential electromagnetic interference (EMI) and radiation pose potential threats to device precision and human health. Another substantial concern pertains to overheating issues that occur during prolonged operation. Therefore, the design of multifunctional soft electronics exhibiting excellent capabilities in sensing, EMI shielding, and thermal management is of paramount importance. Because of the prominent advantages in chemical stability, electrical and thermal conductivity, and easy functionalization, new carbon materials including carbon nanotubes, graphene and its derivatives, graphdiyne, and sustainable natural-biomass-derived carbon are particularly promising candidates for multifunctional soft electronics. This review summarizes the latest advancements in multifunctional soft electronics based on new carbon materials across a range of performance aspects, mainly focusing on the structure or composite design, and fabrication method on the physical signals monitoring, EMI shielding, and thermal management. Furthermore, the device integration strategies and corresponding intriguing applications are highlighted. Finally, this review presents prospects aimed at overcoming current barriers and advancing the development of state-of-the-art multifunctional soft electronics. This review summarizes the latest advancements in new carbon material-based multifunctional soft electronics across a range of performance aspects, emphasizing the effects of microstructural design, fabrication method, and the incorporation of various materials to construct different composites on the physical sensing, EMI shielding, and thermal management. Furthermore, the device integration strategies and corresponding intriguing multifunctional applications are highlighted. image
Keyword:
carbon materials
electromagnetic interference shielding
physical sensing
soft electronics
thermal management
期刊
IF:
26.8
论文数:
3.4W
被引数:
46.0W
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