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On-Chip Transferrable Microdisk Lasers
DOI:10.1021/acsphotonics.0c01330.png)
摘要
En 中文
Si photonics has been receiving substantial attention as an integration platform in photonics and optoelectronic research, owing to the ability to manufacture low-cost, compact integrated circuits. However, realizing efficient and high-quality light sources remains a major challenge. Herein, we report an on-chip transferrable low-threshold single microdisk laser, which is fabricated by the microtransfer printing using a structured polymer. The optically transparent and adhesive microtip enables readily reproducible, damage-free, and precisely aligned mm targeted transfer of a single microdisk in the growth substrate onto a prefabricated Si-post on a silicon-on-insulator wafer. Spectroscopic measurements revealed that the microdisk laser with a small Si-post exhibits rich lasing actions with an estimated threshold of similar to 96.8 mu W. A controlled experiment revealed that laser devices with varied Si-post sizes exhibit no significant changes in optical properties until the size of the Si-post becomes comparable with that of the microdisk. These observations agreed with the results of systematic three-dimensional numerical simulations. We believe that our microtransfer printing technique can be used to transfer micro- and nanostructures onto targeted locations and realize complex microscale heterogeneous architectures in a compact integrated circuit.
Keyword:
microdisk cavities
microlasers
transfer printing
hybrid integration
electromagnetic simulation
integrated photonic circuits
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期刊
IF:
6.7
论文数:
5.6K
被引数:
2.5W
机构
引用论文
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Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers
NATURE PHOTONICS
IF32.9

