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On-Chip Transferrable Microdisk Lasers

delete2020-12-03
delete11
PRE
AI
S
Sun-Wook Park
K
Kim, Min-Woo
K
Kyong-Tae Park
J
Ja-Hyun Ku
Y
You-Shin No *
DOI:10.1021/acsphotonics.0c01330delete
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摘要

摘要

En 中文
Si photonics has been receiving substantial attention as an integration platform in photonics and optoelectronic research, owing to the ability to manufacture low-cost, compact integrated circuits. However, realizing efficient and high-quality light sources remains a major challenge. Herein, we report an on-chip transferrable low-threshold single microdisk laser, which is fabricated by the microtransfer printing using a structured polymer. The optically transparent and adhesive microtip enables readily reproducible, damage-free, and precisely aligned mm targeted transfer of a single microdisk in the growth substrate onto a prefabricated Si-post on a silicon-on-insulator wafer. Spectroscopic measurements revealed that the microdisk laser with a small Si-post exhibits rich lasing actions with an estimated threshold of similar to 96.8 mu W. A controlled experiment revealed that laser devices with varied Si-post sizes exhibit no significant changes in optical properties until the size of the Si-post becomes comparable with that of the microdisk. These observations agreed with the results of systematic three-dimensional numerical simulations. We believe that our microtransfer printing technique can be used to transfer micro- and nanostructures onto targeted locations and realize complex microscale heterogeneous architectures in a compact integrated circuit.
Keyword:
microdisk cavities
microlasers
transfer printing
hybrid integration
electromagnetic simulation
integrated photonic circuits
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期刊

ACS Photonics 封面图
ACS Photonics
IF:
6.7
论文数:
5.6K
被引数:
2.5W

机构

K
Konkuk University
学者数:
1.2W
论文数: 1.1W
被引数: 1.2W
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