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Optical backplane system using waveguide-embedded PCBs and optical slots

delete2004-09-01
delete44
PRE
AI
K
Keun Byoung Yoon
I
I.-K. Cho
S
S.H. Ahn
J
Jeong, NY
D
D.J. Lee
Y
Young Un Heo
B
B.S. Rho
H
Hyung‐Ho Park
B
Byoung Ho Rhee
DOI:10.1109/JLT.2004.833826delete
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摘要

摘要

En 中文
As discussed in this paper, a practical optical backplane system was demonstrated, using a waveguide-embedded optical backplane board, processing boards, and optical slots for board-to-board interconnection. A metal optical bench was used as a packaging die for the optical devices and the integrated circuit chips in both the transmitter and the receiver processing boards. The polymer waveguide was produced by means of a hot-embossing technique and was then embedded following a conventional lamination processes. The average propagation loss of these waveguides was approximately 0.1 dB/cm at 850 nm. The dimension and optical properties of the waveguide in an optical backplane board were unchanged after lamination. As connection components between transmitter/receiver processing boards and an optical backplane board, optical slots were used for easy and repeatable insertion and extraction of the boards with a micrometer-scale precision. A 1 X 4 850-nm vertical-cavity surface-emitting laser array was used with 2 dBm of output power for the transmitter and a p-i-n photodiode Array for the receiver. This paper successfully demonstrates 8 Gb/s of data transmission between the transmitter processing board and the optical backplane board.
Keyword:
board-to-board interconnection
optical backplane
optical printed circuit board (PCB)
optical slots
polymeric waveguide

期刊

Journal of Lightwave Technology 封面图
Journal of Lightwave Technology
IF:
4.8
论文数:
1.7W
被引数:
3.8W

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