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POD-GRU-PINN for electric spindle thermal modeling

delete2026-08-03
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PRE
AI
李鹏 (Peng Li) *
Z
Zhaoyu Shi
L
Lixiu Zhang
S
Songhua Li
R
Ruwei Bao
S
Shiji Lu
DOI:10.1007/s10845-026-02936-xdelete
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Abstract

Abstract

En 中文
To address the challenges of directly accessing the internal temperature field of electric spindle, the heavy computational burden and limited of real-time applicability associated with conventional physics based models, and the restricted cross condition robustness of purely data driven framework under small sample sizes and varying operating conditions, this study develops a cross condition temperature prediction framework for electric spindle that transfers knowledge from finite element simulation to real-world measurements, combining proper orthogonal decomposition with Physics-Augmented GRU (PA-GRU) and domain adversarial alignment. First, transient temperature field data under multiple operating conditions are obtained via finite element simulations, and the high dimensional temperature field is decomposed into spatial modes and time coefficients to obtain a low dimensional representation. Second, physical constraints based on thermal equilibrium mechanisms are imported into the GRU to enhance the framework’s physical consistency. Finally, a data acquisition system is developed to gather actual data across various operating conditions. By combining this with domain-specific adversarial learning mechanisms, the discrepancy between simulation derived and measurement derived features is reduced, thereby enhancing transferability across operating regimes. Experimental results show that under low, medium, and high test conditions, the proposed method maintains both MAE and RMSE within 1 °C, with an accuracy rate exceeding 90% in all cases, demonstrating excellent predictive performance.
Keywords:
Electric spindle
Finite element
Temperature prediction
POD
GRU
PINN

Journal

Journal of Intelligent Manufacturing cover
Journal of Intelligent Manufacturing
IF:
7.4
Papers:
3.4K
Citations:
1.1W

Organization

S
School of Computer Science and Engineering
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1.1K
Papers: 512
Citations: 2
S
School of Mechanical Engineering
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Papers: 1.2K
Citations: 6
C
college of science
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Papers: 990
Citations: 10
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