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Polyimide-based high-temperature-resistant films for electromagnetic-interference shielding
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DOI：10.1016/j.surfin.2024.104819.png)
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Heat-resistant electromagnetic-interference (EMI) shielding materials have received considerable attention for application in extreme environments. In this study, the surface of silicon carbide (SiC) particles were modified using a silane coupling agent. Polyaniline-coated SiC (mSiC@PANI) composites with core-shell structures were subsequently prepared through situ polymerization. Polyimide (PI), a special engineering plastic with excellent thermal stability, was synthesized by prepolymerization, and the resulting ternary PI/mSiC@PANI films exhibited high EMI shielding performance in the X and Ku bands. The EMI shielding efficiency of the composite films with a thickness of 2 mm reaches 35 dB owing to the high conductivity of PANI and interface effect between PANI and SiC, promoting the absorption and attenuation of EM waves. The introduction of high-temperatureresistant SiC filler significantly improves the high-temperature resistance of the PI-based composite films with the thermal decomposition temperature of 600 degrees C, demonstrating their application at temperatures below 300 degrees C for a long period and suitability for EMI shielding in complex environments.
Keyword:
Silicon carbide
Polyaniline
Polyimide
High temperature resistant
Electromagnetic-interference shielding
期刊
IF:
6.3
论文数:
1.0W
被引数:
2.4W
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