.png){kind=icon}
返回
Power Distribution in TSV-Based 3-D Processor-Memory Stacks
.png){kind=icon}
OA
AI
DOI：10.1109/JETCAS.2012.2223553.png)
.png){kind=icon}
.png){kind=icon}
分享.png){kind=icon}
收藏
摘要
En 中文
Three primary techniques for manufacturing through silicon vias (TSVs), via-first, via-middle, and via-last, have been analyzed and compared to distribute power in a 3-D processor-memory system with nine planes. Due to distinct fabrication techniques, these TSV technologies require significantly different design constraints, as investigated in this paper. A valid design space that satisfies the peak power supply noise while minimizing area overhead is identified for each technology. It is demonstrated that the area overhead of a 3-D power distribution network with via-first TSVs is approximately 9% as compared to less than 2% in via-middle and via-last technologies. Despite this drawback, a via-first based power network is typically overdamped and the issue of resonance is alleviated. A via-last based power network, however, exhibits a relatively low damping factor and the peak noise is highly sensitive to the number of TSVs and decoupling capacitance.
Keyword:
Decoupling capacitance
embedded memory
IR drop
Ldi/dt noise
power delivery
power supply noise
processor-memory stacks
three-dimensional (3-D) integrated circuits
through silicon via (TSV)
via-first
via-middle
via-last
AI总结
对已上传原文的论文进行重点信息的提取，主要内容包括：简要概述、研究摘要、背景介绍、关键亮点、图文解析、展望与总结。
期刊
IF:
3.8
论文数:
1.4K
被引数:
2.8K
机构
引用论文
Preparation of TiO2/Hydroxyapatite Composite and Its Photocatalytic Degradation of Methyl Orange
PREAI
分享收藏Mitigating Memory Wall Effects in High-Clock-Rate and Multicore CMOS 3-D Processor Memory Stacks.png)
PROCEEDINGS OF THE IEEE
PROCEEDINGS OF THE IEEEIF25.9
PREAI
分享收藏NOVEL POINT- OF- CARE (POC) PLATFORM FOR DIRECT ORAL ANTICOAGULANTS (DOAC) AND VITAMIN K ANTAGONISTS (AVK) TESTING: MICRODOAC AND MICROINR ASSAYS新型即时检测（POC）平台用于直接口服抗凝剂（DOAC）和维生素K拮抗剂（AVK）检测：MicroDOAC和MicroINR检测方法
PREAI
分享收藏3-D ICs: A novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integrationPROCEEDINGS OF THE IEEE
PROCEEDINGS OF THE IEEEIF25.9
PREAI
分享收藏
查看更多内容