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Relationship between grain boundary characteristic and liquation cracking susceptibility of alloy 625
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DOI：10.1016/j.matdes.2025.115400.png)
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Abstract
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• Ratios of CSL boundaries and Σ9 + Σ27 boundaries both increases with annealing time. • Melting temperature reduces in order of CSL boundary, random boundary, and NbC. • Liquation crack primarily occurs at random boundaries and hardly at CSL boundaries. • Effective distribution of CSL boundary reduces liquation cracking susceptibility.
Keywords:
Liquation cracking
Grain boundary engineering
Segregation
Hot cracking
Coincidence site lattice boundary
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