Solid-Liquid Interdiffusion Bonding Enabling Heterogeneous Integration on Flexible and Shapeable Polymer Platforms

doi:10.1002/smtd.71031

2026-10-07

PRE

Yeji Lee

Vineeth Kumar Bandari *

Daniil Karnaushenko

Dmitriy D. Karnaushenko

DOI：10.1002/smtd.71031

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摘要

En 中文

将刚性微尺度电子器件集成到软性和柔性聚合物基板上仍然是柔性电子、生物集成系统和以身体为优先的微机器人领域的关键挑战，其中机械结构、材料架构、形态和主要功能被优先设计，而作为控制机器人功能“大脑”的电子处理单元（例如Si CMOS芯片），则是在后期集成。现有方法包括各向异性导电胶和转印印刷，依赖于不可图案化的或基于颗粒的互连、厚粘合层或复杂工艺，限制了互连密度、可扩展性以及与弯曲、卷曲或折叠等机械变形的兼容性。本文提出了一种图案化固-液互扩散（SLID）键合方法，可实现与标准微制造兼容的确定性的、细间距的异质集成于超薄聚合物基板上。在5 µm聚酰亚胺上制备的电解Cu/Sn柱状凸点被系统表征，以定义可靠的SLID键合的几何、电学和力学工艺窗口。所得到的互连具有可控的焊料回流、低电学电阻、高机械鲁棒性，且无需粘合剂或导电颗粒，最小柱间间距可达10 µm。通过SLID键合的微尺度发光二极管在自卷曲、弯曲以及折叠驱动的三维组装过程中与集成硅微芯片保持功能正常。该工作为机械可重构微机器人和柔性微系统提供了一种可扩展的框架。

Keyword:

bonding process

flexible electronics

materials science

microfabrication

microsystem

process engineering

process integration

期刊

Small Methods

IF:

9.1

论文数:

4.3K

被引数:

2.2W

机构

Chemnitz University of Technology

学者数:

论文数: 16

被引数: 0

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