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Solid-state dewetting on curved substrates
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DOI：10.1103/PhysRevMaterials.2.113401.png)
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摘要
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Based on the thermodynamic variation to the free-energy functional, we propose a sharp-interface model for simulating solid-state dewetting of thin films on rigid curved substrates in two dimensions. This model describes the interface evolution which occurs through surface diffusion-controlled mass transport and contact point migration along the curved substrate. Furthermore, the surface energy anisotropy is easily included into the model, and the contact point migration is explicitly described by the relaxed contact angle boundary condition. We implement the mathematical model by a semi-implicit parametric finite-element method to study several interesting phenomena, such as small particle migration on curved substrates and templated solid-state dewetting on a prepatterned substrate. Based on ample numerical simulations, we demonstrate that, the migration velocity of a small solid particle is proportional to the substrate curvature gradient (k) over cap' and inversely proportional to the square root of the area of the particle root A, and it decreases when the isotropic Young's angle theta(i) increases. In addition, we also observe four periodic categories of dewetting on a prepatterned sinusoidal substrate. Our approach can provide a convenient and powerful tool for exploring how to produce well-organized nanoparticles by making use of template-assisted solid-state dewetting.
Keyword:
CAPILLARY INSTABILITIES
THERMAL AGGLOMERATION
METAL PARTICLES
THIN
SI
KINETICS
GROWTH
FILM
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