.png){kind=icon}
返回
Stamp collapse in soft lithography
.png){kind=icon}
PRE
AI
DOI：10.1021/la0502185.png)
.png){kind=icon}
原文求助.png){kind=icon}
分享.png){kind=icon}
收藏
摘要
En 中文
We have studied the so-called roof collapse in soft lithography. Roof collapse is due to the adhesion between the PDMS stamp and substrate, and it may affect the quality of soft lithography. Our analysis accounts for the interactions of multiple punches and the effect of elastic mismatch between the PDMS stamp and substrate. A scaling law among the stamp modulus, punch height and spacing, and work of adhesion between the stamp and substrate is established. Such a scaling law leads to a simple criterion against the unwanted roof collapse. The present study agrees well with the experimental data.
AI总结
对已上传原文的论文进行重点信息的提取，主要内容包括：简要概述、研究摘要、背景介绍、关键亮点、图文解析、展望与总结。
期刊
IF:
3.9
论文数:
5.4W
被引数:
10.6W
机构
暂无机构信息
引用论文
Effect of stamp deformation on the quality of microcontact printing: Theory and experiment.png)
LANGMUIR
LANGMUIRIF3.9
PREAI
分享收藏
Three-dimensional and multilayer nanostructures formed by nanotransfer printing通过纳米转印形成的三维和多层纳米结构NANO LETTERS
NANO LETTERSIF9.1
PREAI
分享收藏 没有更多内容
没有更多内容