.png){kind=icon}
返回
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
.png){kind=icon}
摘要
En 中文
Latest handheld electronic devices are mostly incorporated with multi-function features and user friendly applications. Hence, the power consumption and battery operating time have become a very critical design consideration during product design stage.. An optical sensor is developed to reduce power consumption, it is called Ambient light sensor. It detects light in the manner similar to human eyes, when ambient light brightness change, the sensor can turn on, turn off or adjust in relation to the brightness level. The ambient light sensor must be encapsulated by transparent compound, with minimum 80% transmittance requirement level, this is to allow sufficient light penetrates into compound and reaches optical sensor. There are different mold material and methods developed for the optical sensor, such as liquid cast mold method, injection mold method or transfer mold method. In this paper, Carsem introduce transfer molding Clear MLP packaging method; which is relatively high productive and cost effective packaging assembly method for the ambient light sensor.
AI总结
对已上传原文的论文进行重点信息的提取，主要内容包括：简要概述、研究摘要、背景介绍、关键亮点、图文解析、展望与总结。
