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Thermal interface materials for thermal management of Insulated Gate Bipolar Transistor
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DOI：10.1016/j.rser.2026.117011.png)
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Abstract
En 中文
• The cooling methods and temperature monitoring techniques for IGBT were summarized. • Performances of TIMs in IGBT, including thermal conductivity and interfacial thermal resistance, were presented. • Recent challenges and prospects in the application of TIMs in IGBT thermal management were discussed.
Keywords:
IGBT
Thermal interface materials
Thermal management
Thermal conductivity
Interfacial thermal resistance
Journal
IF:
16.3
Papers:
1.6W
Citations:
18.5W
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Cited Papers