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Thicker amorphous grain boundary complexions reduce plastic strain localization in nanocrystalline Cu-Zr

delete2026-06-05
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PRE
AI
E
Esther C. Hessong
N
Nicolò Maria della Ventura
T
Tongjun Niu
D
Daniel S. Gianola
H
Hyosim Kim
N
Nan Li
S
Saryu Fensin
B
Brad Boyce
T
Timothy J. Rupert *
DOI:10.1016/j.scriptamat.2026.117437delete
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Abstract

Abstract

En 中文
Amorphous grain boundary complexions have been shown to increase the plasticity of nanocrystalline alloys as compared to ordered grain boundaries. Here, the effect of an important structural descriptor, amorphous complexion thickness, on the plasticity and failure modes of nanocrystalline Cu-Zr is studied with in-situ compression testing, with over 50 micropillars tested. Two model materials were created that differ only in their complexion thickness, with one having a thicker complexion population than the other. The sample with thinner complexions was more likely to experience non-uniform plastic deformation in the form of localized plastic flow or shear banding. In contrast, the sample with thicker complexions displayed more homogeneous plasticity and higher damage tolerance; thicker amorphous complexions suppress localization by absorbing defects. This work demonstrates that increasing complexion thickness can be beneficial for stable plastic flow in nanocrystalline alloys, by improving resistance to strain localization and premature failure.
Keywords:
Compression test
Grain boundary strengthening
Plasticity
Copper alloys
Nanocrystalline materials

Journal

Scripta Materialia cover
Scripta Materialia
IF:
5.6
Papers:
1.6W
Citations:
5.1W

Organization

L
los alamos national laboratory
Scholars:
641
Papers: 238
Citations: 0
U
University of California
Scholars:
7.3K
Papers: 2.8K
Citations: 8.3W
C
Center for Integrated Nanotechnologies
Scholars:
27
Papers: 14
Citations: 2.2K
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