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Triple junction effects in solids
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DOI：10.1016/j.actamat.2011.02.024.png)
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摘要
En 中文
The grain boundary free surface triple line tension and grain boundary triple line tension were investigated in copper using a recently introduced novel approach. The effect of triple line tension on grain growth, Zener drag and Gibbs-Thompson relation was studied. The results showed that the triple line tension has a considerable effect on grain growth, particle boundary interactions and void shape, especially for nanocrystalline materials. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Keyword:
Grain boundary triple junction
Zener drag
Gibbs-Thompson equation
Triple line energy
期刊
IF:
9.3
论文数:
2.0W
被引数:
12.9W
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