logo
科言猫学术研究的AI总结
language
手机端手机端
  • Phone Feature微信小程序
简体中文简体中文
notice消息通知
博客博客
delete
arrow
返回

TSV Electromigration Failure Prediction Using Multiphysics Coupled Energy Method

delete2025-09-02
delete0
PRE
AI
L
Leru Luo
X
Xiaojing Zheng
Q
Qingya Li
DOI：10.1016/j.ijmecsci.2025.110758delete
delete原文链接
delete原文求助
delete分享
delete收藏
摘要

摘要

En 中文
• 一种新型能量模型将Gibbs能和电磁诱导的TSV空位成核联系起来。 • 预测值与实验数据相比，误差范围在±11.25单位内。 • 焦耳热和应力将电磁失效时间的预测精度提高了80%。 • 异质性驱动的多成核导致与电学电阻相关的失效。
Keyword:
Gibbs energy
electromigration
void nucleation
time-to-failure prediction
Joule heating
electrical resistance
heterogeneous nucleation

期刊

International Journal of Mechanical Sciences 封面图
International Journal of Mechanical Sciences
IF:
9.4
论文数:
1.0W
被引数:
4.5W

机构

X
Xidian University
学者数:
2.4W
论文数: 1.9W
被引数: 9.7K
引用论文

引用论文

Stress evolution due to electromigration in confined metal lines由于受限金属线中的电迁移而引起的应力演变
errJournal of Applied Physics
IF0
err1993-04-15
err0
PREAI
errM. A. Korhonen; P. Bo/rgesen; K. N. Tu; Che-Yu Li
err分享
err收藏
High temperature electromigration behavior of cobalt lines observed by in situ transmission electron microscopy
errAPPLIED PHYSICS LETTERS
IF3.6
err2023-08-21
err3
PREAI
errEngler, Brent; Hull, Robert
err分享
err收藏
A co-optimization method of thermal-stress coupling 3D integrated system with through silicon via
errSTRUCTURAL AND MULTIDISCIPLINARY OPTIMIZATION
IF4
err2023-11-29
err4
PREAI
errWang, Xianglong; Chen, Dongdong; Li, Di; Yang, Yintang
err分享
err收藏
Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
errINTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF5.8
err2018-05-01
err29
PREAI
errPi, Yudan; Wang, Ningyu; Chen, Jing; Miao, Min; Jin, Yufeng; Wang, Wei
err分享
err收藏
Electromigration in three-dimensional integrated circuits
errAPPLIED PHYSICS REVIEWS
IF11.6
err2023-05-16
err18
PREAI
errShen, Zesheng; Jing, Siyi; Heng, Yiyuan; Yao, Yifan; Tu, K. N.; Liu, Yingxia
err分享
err收藏
Cu interconnect lifetime estimation in the presence of thermal gradientsCu互连在热梯度存在下的寿命预测
errJOURNAL OF APPLIED PHYSICS
IF2.5
err2025-02-19
err0
errOAAI
errDing, Y.; Pedreira, O. Varela; Lofrano, M.; Zahedmanesh, H.; Ciofi, I.; Chavez, T.; Farr, H.; De Wolf, I.; Croes, K.
err分享
err收藏
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects高级铜互连中热迁移诱发的空洞形成研究
errIEEE Transactions on Components, Packaging and Manufacturing Technology
IF0
err2025-08-01
err0
PREAI
errLiang,Shuibao; Jiang,Han; Zhou,Rongxin; Xu,Yaohua; Ramachandran,Saranarayanan
err分享
err收藏
Minimization of Electrical Signal Interference with Appropriate Core Material for 3D IC at THz Applications
errTransactions on Electrical and Electronic Materials
IF0
err2023-11-29
err0
PREAI
errSantosh Kumar Tallapalli; V. Vijayakumar; N. Arun Vignesh; Asisa Kumar Panigrahy
err分享
err收藏
Electromigration in metals
errReports on Progress in Physics
IF0
err1999-01-01
err0
PREAI
errP S Ho; T Kwok
err分享
err收藏
Current-induced marker motion in gold wires金线中的电流感应标记运动
errJournal of Physics and Chemistry of Solids
IF0
err1961-06-01
err0
PREAI
errH.B. Huntington; A.R. Grone
err分享
err收藏
学者 查看更多内容