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3D integrated photonics platform with deterministic geometry control

delete2020-01-31
delete14
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OA
AI
J
Jérôme Michon *
S
Sarah Geiger
L
Lan Li
C
Claudia Gonçalves
林宏焘 (Hongtao Lin)
K
Kathleen Richardson
X
Xinqiao Jia
J
Juejun Hu
DOI:10.1364/PRJ.375584delete
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Abstract

Abstract

En 中文
3D photonics promises to expand the reach of photonics by enabling the extension of traditional applications to nonplanar geometries and adding novel functionalities that cannot be attained with planar devices. Available material options and device geometries are, however, limited by current fabrication methods. In this work, we pioneer a method that allows for placement of integrated photonic device arrays at arbitrary predefined locations in 3D using a fabrication process that capitalizes on the buckling of a 2D pattern. We present theoretical and experimental validation of the deterministic buckling process, thus demonstrating implementation of the technique to realize what we believe to be the first fully packaged 3D integrated photonics platform. Application of the platform for mechanical strain sensing is further demonstrated. (C) 2020 Chinese Laser Press
Keywords:
SENSOR
ARCHITECTURES
ORIGAMI
GUIDE

Journal

Photonics Research cover
Photonics Research
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1.3W

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State University System of Florida cover
State University System of Florida
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University of Delaware
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