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A comparative study of curing kinetics in formaldehyde-based wood adhesives using isothermal rheology and ABES
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DOI：10.1007/s10973-026-16077-z.png)
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Abstract
En 中文
A variety of techniques exist to study the curing behavior of wood adhesives throughout the hot-pressing. Nonetheless, correlating these techniques is challenging, primarily due to the inherent differences in their operational principles and measurement conditions. This study correlates the chemical, rheological and mechanical aspects of adhesive curing using differential scanning calorimetry (DSC), rheometry and Automated Bonding Evaluation System (ABES), respectively. DSC determines the chemical curing degree, and rheometry captures both chemical and physical aspects of curing, while ABES simulates adhesive bond strength development by focusing on mechanical changes. Results reveal that the rheological curing degree exhibits a higher reaction rate than the mechanical curing degree from ABES. DSC was also used to measure the residual enthalpy of adhesives after isothermal curing using rheometry or ABES. The results suggest that the tested adhesives cannot be considered fully chemically cured when complex viscosity and shear strength reach their maximum values. Dynamic DSC analyses were used for the prediction of the curing degree at isothermal conditions. At higher curing temperatures, the differences between the resulting conversion degrees from DSC, rheometry, and ABES techniques decrease. DSC is highly sensitive to reaction onset, while rheometry more accurately tracks curing progress through viscosity changes. ABES lacks sensitivity to chemical progression but offers practical mechanical insights. Furthermore, the time to reach the minimum activation energy was determined using the isoconversional principle. It was found that the activation energy achieves its minimum in the immediate vicinity of the gel and the storage and loss moduli crossover point for tested amino resins.
Keywords:
Rheometry
ABES
Curing kinetics
Mechanical cure
Gel point
Activation energy
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3.1
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1.8W
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3.2W
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