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A Coordinated Optimization Framework for Placement Machine Programming in Multiorder PCB Assembly

delete2026-10-14
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PRE
AI
Y
Yuhang Bi
G
Guangyu Lu
Z
Zhengkai Li
H
Hao Sun
X
Xinghu Yu
Z
Zhitai Liu
J
Jianbin Qiu
J
Juan J. Rodríguez-Andina
DOI:10.1109/tii.2026.3737408delete
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Abstract

Abstract

En 中文
High-mix and low-volume printed circuit board (PCB) assembly requires frequent production switching among different PCB orders on the same placement machine. Conventional separate-order programming optimizes each order independently, which may lead to repeated feeder reconfiguration and nozzle change when consecutive orders are executed. To address this issue, this article proposes a coordinated nozzle assignment and feeder arrangement (CNAFA) framework that integrates cross-order resource configuration with order-level execution planning, rather than treating nozzle assignment, feeder arrangement, and pick-and-place (PAP) optimization as isolated decisions. A multiorder production-time formulation is established to jointly characterize order-level execution time and transition-related setup time, enabling these coupled decisions to be optimized under a unified objective. Within this framework, nozzle configurations are coordinated across orders, while the shared feeder arrangement is optimized by an embedded evolutionary search with a picking-based surrogate fitness. The PAP solver further generates executable cycle-level head assignments and picking and placement sequences under the resulting fixed resource configurations. Experiments on industrial PCB orders using machine-recorded production times show average production-time reductions of 17.9% over Panasonic DGS and 13.9% over UCH across 32 feasible two-order combinations, with similar advantages observed for larger order batches. These results demonstrate the effectiveness and practical value of CNAFA for multiorder PCB assembly.
Keywords:
Evolutionary search
feeder arrangement
multiorder printed circuit board (PCB) assembly
nozzle configuration
placement machine
surface mount technology (SMT)

Journal

IEEE Transactions on Industrial Informatics cover
IEEE Transactions on Industrial Informatics
IF:
9.9
Papers:
8.6K
Citations:
6.0W

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U
University of Vigo
Scholars:
10
Papers: 8
Citations: 0
H
Harbin Institute of Technology
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Papers: 1.3K
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N
ningbo university of technology
Scholars:
195
Papers: 102
Citations: 0
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