.png){kind=icon}
.png){kind=icon}
Return
A double-helix plane winding sensor with wire using transient plane source method
.png){kind=icon}
PRE
AI
DOI：10.1016/j.applthermaleng.2024.124742.png)
.png){kind=icon}
Original request for help.png){kind=icon}
Share.png){kind=icon}
Save
Abstract
En 中文
The transient plane source (TPS) method is widely used to measure thermophysical properties of various materials, and the high-precision double-helix sensor is a key technology. A novel sensor using an efficient, simple, and low-cost lacquered micron-wire-wound process is proposed to replace traditional complex micro- and nanoetching processes. The TPS test platform was built based on the Wheatstone Bridge theory. A new sensor sample of diameter 5.377 mm was wound with an enameled copper wire of diameter 0.063 mm. Owing to the characteristics of the process, a 1-mm round hole was bored inside the sensor. An analytical solution for the concentric ring heat transfer model of the sensor with a central circular hole structure was derived, and a twodimensional concentric circle simulation model of the sensor was established. As the number of turns decreased, the average error between the analytical solution of the concentric ring model with a large center hole (LHAS) and that of the traditional concentric circle model (TAS), as well as LHAS and the simulation model, gradually increased. The maximum relative errors between LHAS and TAS, as well as between LHAS and the simulation model, were 23.69% and 0.1 %, respectively, and the average errors of the absolute maximum were 11.86% and -0.06 %, respectively. The LHAS exhibited excellent accuracy because of the structural characteristics of the novel sensor. The accuracy of LHAS has been validated by simulation and hot wire method. Temperature rise data of high-borosilicate glass and polytetrafluoroethylene samples at different powers were obtained. The thermal properties of the samples were determined by fitting LHAS and TAS data. The thermal conductivity errors measured by LHAS were smaller than those measured by TAS, the thermal conductivity and thermal diffusivity errors were less than 3.5 % at different powers, and the measured repeatability errors were less than 1 %, indicating the good application prospect of the proposed model.
Keywords:
Transient plane source method
Winding model
Thermal conductivity
Thermal diffusivity
Sensitivity analysis
Journal
IF:
6.9
Papers:
2.7W
Citations:
10.6W