logo
CanyamAI summaries for academic research
language
MobileMobile
  • Phone FeatureWeChat Mini Program
EnglishEnglish
noticeNotice
BlogBlog
delete
arrow
Return

Adaptative two-phase thermal circulation system for complex-shaped electronic device cooling

delete2025-02-17
delete2
delete
OA
AI
徐文君 cover
徐文君 (Wenjun Xu)
M
Ma, Yao
H
Hu, Zhanpeng
Q
Qi, Yuyang
L
Li, Xinying
Z
Zhong, Yuchen
L
Luo, Tao
W
Wu, Linjing
L
Ling, Weisong
DOI：10.1038/s41467-025-56960-1delete
deleteOriginal
deleteOriginal request for help
deleteShare
deleteSave
Abstract

Abstract

En 中文
Thermal management using a vapor-liquid two-phase circulation system is challenging in compact and complex-shaped electronic devices. In this study, we design and fabricate a heat pipe that can adapt to various shapes, regardless of space constraints. The heat pipe is capable of bending or twisting in three dimensions, making it suitable for electronic devices of arbitrary shapes. It effectively transfers heat from in-plane chips to out-of-plane spaces through flexible circulation pathways. This two-phase heat cycle system achieves an ultra-high thermal conductivity of up to 11,363 W/mK. The flexible and adaptive design strategy enables efficient heat transfer in complex and compact environments.
Keywords:
FLAT HEAT-PIPE
WICK
FABRICATION
PERFORMANCE
CONDUCTIVITY
FILM

Journal

Nature Communications cover
Nature Communications
IF:
15.7
Papers:
9.3W
Citations:
91.2W

Organization

No organization information available