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Advanced Microsink Design Utilizing Disruptive Structures
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DOI：10.1080/01457632.2026.2632429.png)
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Abstract
En 中文
This study explores the development of innovative microsink designs to enhance cooling efficiency at low pumping power for compact electronic devices. Three-dimensional simulations of conjugate heat transfer and fluid flow in rectangular microchannels were conducted, focusing on novel geometries fan-shaped cavities, fan-shaped cavities with ribs, fan-shaped cavities with secondary branches, and fan-shaped cavities with both secondary branches and ribs. Performance was evaluated using average friction factor, Nusselt number, and thermal performance across Reynolds numbers from 135 to 603. The highest thermal performance achieved by fan-shaped cavities with both secondary branches and ribs among the all channels. The systematic variation of the relative geometric variable of fan-shaped cavities with both secondary branches and ribs attain the highest thermal performance equal to 1.75 at Reynolds number of 603 with the combination of the secondary branch width equal 0.75, secondary branch angle equal to 0.166, fan-shaped cavity width equal to 1, fan shaped cavity length equal to 0.055, and pitch distance equal to 0.2. The disruption of thermal boundary layer by longitudinal and transverse vortices contributes to augment the heat transfer with cost of pressure drop. The role of vortex-induced mixing in heat transfer enhancement is comprehensively demonstrated.
Keywords:
SHAPED REENTRANT CAVITIES
CONVECTIVE HEAT-TRANSFER
RECTANGULAR MICROCHANNEL
PERFORMANCE
SINK
FLOW
ENHANCEMENT
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