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Aliasing in wavefield extrapolation prestack migration
DOI:10.1190/1.1567232.png)
Abstract
En
Keywords:
KIRCHHOFF MIGRATION
Journal
IF:
3.2
Papers:
8.4K
Citations:
3.3W
Organization
No organization information available
Cited Papers
Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging
Metals
IF0
no more

