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An integrated microstructural superhydrophobic copper-foam evaporator for extreme heat flux cooling.
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DOI：10.1016/j.applthermaleng.2026.132755.png)
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Abstract
En 中文
• Integrated design breaks the CHF-HTC trade-off in high-flux cooling. • The synergistic enhancement of CHF (414.5 W/cm2) and HTC (77.5 W·m−2·K−1) was demonstrated under a mass flux of 66 kg/(m2·s). • Visualization reveals minichannel confinement promotes vapor-liquid separation. • Synergistic wettability and pore density enable efficient vapor escape and liquid replenishment.
Keywords:
High heat flux electronic cooling
Copper foam
Wettability engineering
Vapor-liquid separation
Bubble dynamics
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