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Bond graph based sensitivity and uncertainty analysis modelling for micro-scale multiphysics robust engineering design
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DOI：10.1016/j.jfranklin.2007.10.002.png)
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Abstract
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Components within micro-scale engineering systems are often at the limits of commercial miniaturization and this can cause unexpected behavior and variation in performance. As such, modelling and analysis of system robustness plays an important role in product development. Here, schematic bond graphs are used as a front end in a sensitivity analysis based strategy for modelling robustness in multi-physics micro-scale engineering systems. As an example, the analysis is applied to a behind-the-ear ( BTE) hearing aid. By using bond graphs to model power flow through components within different physical domains of the hearing aid, a set of differential equations to describe the system dynamics is collated. Based on these equations, sensitivity analysis calculations are used to approximately model the nature and the sources of output uncertainty during system operation. These calculations represent a robustness evaluation of the current hearing aid design and offer a means of identifying potential for improved designs of multiphysics systems by way of key parameter identification. (C) 2007 The Franklin Institute. Published by Elsevier Ltd. All rights reserved.
Keywords:
bond graph modelling
sensitivity analysis
uncertainty analysis
hearing aid device
multiphysics
robustness
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