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Bonding-process-dependent interfacial corrosion of Ni-316H clad plates under thermal cycling and local damage conditions
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DOI：10.1016/j.corsci.2026.114129.png)
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Abstract
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• Bonding process governs interfacial architecture and corrosion-path selection. • Ultrafine-grained EX interfaces enable stress-assisted, interface-guided corrosion. • Galvanic coupling accelerates elemental migration without controlling localization. • Corrosion-induced Cr depletion triggers region-specific carbide evolution. .
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