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Bridging Precision and Scalability in Van der Waals Assembly Engineering via Lens-Enhanced Optical Transfer
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DOI：10.1002/smtd.202600011.png)
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Abstract
En 中文
2D materials hold immense promise for next-generation electronics and quantum technologies. However, their full potential has been hindered by the lack of scalable transfer techniques that can simultaneously enable high-precision, deterministic placement, and enhance imaging quality to ensure accurate transfer by both human and automated methods. Here, we present a room-temperature transfer method integrating an optical-grade N-BK7 hemispherical lens with a polydimethylsiloxane (PDMS) stamp system, resolving the fundamental trade-off between transfer precision and optical resolution. Our technique achieves three key advances while eliminating any thermal processing: (1) 34 % $34\%$ improvement in imaging resolution through aberration correction, (2) > 95 % $>\!95\%$ transfer success rates, and (3) universal compatibility with diverse architectures, including patterned electrodes, etched substrates, and nanopillar arrays. Our method achieves the placement accuracy as low as 10 μ m $10\nobreakspace \mu \mathrm{m}$ and is fully compatible with motorized staging. This enables the selective pickup of target flakes and effectively eliminates non-target material, which can occupy valuable space or lead to electrical shorts in pre-patterned fabricated devices, establishing a transformative platform for scalable production of van der Waals heterostructures. This advance bridges the critical gap between laboratory research and industrial-scale manufacturing of 2D material devices.
Keywords:
2D materials
deterministic transfer
etched substrate
nanopillars
single flake pickup
van der Waals heterostructures
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