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Coupled deformation-diffusion processing window for bimetal interface bonding
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DOI：10.1016/j.jallcom.2026.191519.png)
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Abstract
En 中文
• Deformation and diffusion factors are proposed to evaluate bimetal bonding.
• Strain partitioning dominates deformation coordination and interface evolution.
• Coordinated deformation promotes uniform diffusion and diffusion-layer formation.
• A processing window is established based on deformation-diffusion coupling.
Keywords:
Bimetal
Interface bonding
Processing window
Deformation coordination
Element diffusion
Journal
IF:
6.3
Papers:
8.4W
Citations:
24.3W
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